MT58L256L32D Micron Semiconductor Products, Inc., MT58L256L32D Datasheet - Page 25

• Manufacturer Part Number: MT58L256L32D
• Description: 8Mb Syncburst SRAM, 3.3V Vdd, 3.3V I/O, Pipelined, Dcd,
• Manufacturer: Micron Semiconductor Products, Inc.

8Mb: 512K x 18, 256K x 32/36 3.3V I/O, Pipelined, DCD SyncBurst SRAM
MT58L512L18D_D.p65 – Rev. 2/02
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
Micron is a registered trademark and the Micron logo and M logo are registered trademarks of Micron Technology, Inc.
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
15.00 ±0.10
165X Ø 0.45
BALL A11
7.50 ±0.05
7.00 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.85 ±0.075
5.00 ±0.05
SyncBurst is a trademark of Micron Technology, Inc.
13.00 ±0.10
MIN
10.00
3.3V I/O, PIPELINED, DCD SYNCBURST SRAM
6.50 ±0.05
1.00
TYP
165-PIN FBGA
C
1.00
TYP
25
BALL A1
PIN A1 ID
14.00
SEATING PLANE
0.12 C
8Mb: 512K x 18, 256K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2002, Micron Technology, Inc.