MT58L128L32D1 Micron Semiconductor Products, Inc., MT58L128L32D1 Datasheet - Page 25

• Manufacturer Part Number: MT58L128L32D1
• Description: 4Mb Syncburst SRAM, 3.3V Vdd, 3.3V I/O, Pipelined, Dcd,
• Manufacturer: Micron Semiconductor Products, Inc.

4Mb: 256K x 18, 128K x 32/36 3.3V I/O Pipelined, DCD SyncBurst SRAM
MT58L256L18D1_F.p65 – Rev. F, 1/03 EN
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
DATA SHEET DESIGNATIONS
No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply
E-mail: [e-mail], Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
15.00 ±0.10
Micron, the Micron logo, M logo, and SyncBurst are trademarks and/or service marks of Micron Technology, Inc.
165X Ø 0.45
BALL A11
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
7.50 ±0.05
7.00 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.85 ±0.075
5.00 ±0.05
MIN
13.00 ±0.10
10.00
3.3V I/O PIPELINED, DCD SYNCBURST SRAM
6.50 ±0.05
165-PIN FBGA
1.00
TYP
25
C
1.00
TYP
BALL A1
PIN A1 ID
4Mb: 256K x 18, 128K x 32/36
14.00
SEATING PLANE
0.12 C
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL:
EUTECTIC 62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2003, Micron Technology, Inc.