MT57W1MH18J Micron Semiconductor Products, Inc., MT57W1MH18J Datasheet - Page 9

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MT57W1MH18J

Manufacturer Part Number
MT57W1MH18J
Description
18Mb Ddrii SRAM, 1.8V Vdd, Hstl, 4-Word Burst,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet
Table 5:
18Mb: 1.8V V
MT57W1MH18J_H.fm – Rev. H, Pub. 3/03
SYMBOL
CQ#, CQ
NW_#
BW_#
V
R/W#
DLL#
TMS
DQ_
TDO
V
LD#
SA0
SA1
TCK
V
TDI
V
ZQ
K#
SA
DD
C#
K
C
REF
DD
SS
Q
DD
, HSTL, DDRIIb4 SRAM
Output
Output
Output
Supply
Supply
Supply
Input/
TYPE
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Ball Descriptions
DESCRIPTION
Synchronous Byte Writes (or Nibble Writes on x8): When LOW, these inputs cause their respective
bytes or nibbles to be registered and written if W# had initiated a WRITE cycle. These signals must
meet setup and hold times around the rising edges of K and K# for each of the four rising edges
comprising the WRITE cycle. See Ball Layout figures for signal to data relationships.
Output Clock: This clock pair provides a user-controlled means of tuning device output data. The
rising edge of C# is used as the output timing reference for first and third output data. The rising
edge of C is used as the output reference for second and fourth output data. Ideally, C# is 180
degrees out of phase with C. C and C# may be tied HIGH to force the use of K and K# as the output
reference clocks instead of having to provide C and C# clocks. If tied HIGH, these inputs may not be
allowed to toggle during device operation.
DLL Disable: When LOW, this input causes the DLL to be bypassed for stable, low-frequency
operation.
Input Clock: This input clock pair registers address and control inputs on the rising edge of K and
registers data on the rising edge of K and the rising edge of K#. K# is ideally 180 degrees out of
phase with K. All synchronous inputs must meet setup and hold times around the clock rising edges.
Synchronous Load: This input is brought LOW when a bus cycle sequence is to be defined. This
definition includes address and read/write direction. All transactions operate on a burst of four data
(two clock periods of bus activity).
Synchronous Read/Write Input: When LD# is LOW, this input designates the access type (READ when
R/W# is HIGH; WRITE when R/W# is LOW) for the loaded address. R/W# must meet the setup and
hold times around the rising edge of K.
Synchronous Address Inputs: These inputs are registered and must meet the setup and hold times
around the rising edge of K. See Ball Layout figures for address expansion inputs. All transactions
operate on a burst of four words (two clock periods of bus activity). SA0 and SA1 are used as the
lowest two address bits for BURST READ and BURST WRITE operations, permitting a random burst
start address on the x18 and x36 devices. These inputs are ignored when both ports are deselected.
IEEE 1149.1 Clock Input: 1.8V I/O levels. This ball must be tied to V
in the circuit.
IEEE 1149.1 Test Inputs: 1.8V I/O levels. These balls may be left as No Connects if the JTAG function is
not used in the circuit.
HSTL Input Reference Voltage: Nominally V
buffer trip points.
Output Impedance Matching Input: This input is used to tune the device outputs to the system data
bus impedance. DQ and CQ output impedance are set to 0.2 x RQ, where RQ is a resistor from this
ball to ground. Alternately, this ball can be connected directly to V
impedance mode. This ball cannot be connected directly to GND or left unconnected.
Synchronous Data Inputs: Input data must meet setup and hold times around the rising edges of K
and K#. Output data is synchronized to the respective C and C# data clocks or to K and K#, if C and
C# are tied HIGH. See Ball Layout figures for ball site location of individual signals. The x8 device
uses DQ0-DQ7. Remaining signals are NC. The x18 device uses DQ0-DQ17. Remaining signals are NC.
The x36 device uses DQ0-DQ35. Remaining signals are NC.
Synchronous Echo Clock Outputs: The edges of these outputs are tightly matched to the
synchronous data outputs and can be used as data valid indication. These signals run freely and do
not stop when DQ tri-states.
IEEE 1149.1 Test Output: 1.8V I/O level.
Power Supply: 1.8V nominal. See DC Electrical Characteristics and Operating Conditions for range.
Power Supply: Isolated Output Buffer Supply. Nominally 1.5V. 1.8V is also permissible. See DC
Electrical Characteristics and Operating Conditions for range.
Power Supply: GND.
9
2 MEG
DD
1.8V V
Q/2. Provides a reference voltage for the HSTL input
Micron Technology, Inc., reserves the right to change products or specifications without notice.
X
8, 1 MEG
DD
, HSTL, DDRIIb4 SRAM
SS
DD
if the JTAG function is not used
Q to enable the minimum
X
18, 512K
©2003 Micron Technology, Inc.
X
36

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