MT28C6428P20 Micron Semiconductor Products, Inc., MT28C6428P20 Datasheet - Page 47

• Manufacturer Part Number: MT28C6428P20
• Description: 4 Meg X 16 Asynchronous/page Flash 512K X 16 SRAM Combo Memory
• Manufacturer: Micron Semiconductor Products, Inc.

SEATING PLANE
NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATION
Advance: This data sheet contains initial descriptions of products still under development.
4 Meg x 16 Asynchronous/Page Flash 512K x 16 SRAM Combo Memory
MT28C6428P20_3.p65 – Rev. 3, Pub. 7/02
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
5.60
67X ∅0.35
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
0.12 C
2.80 ±0.05
BALL A12
1.05 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
4.40 ±0.05
0.80 (TYP)
11.50 ±0.10
8.80
C L
5.75 ±0.05
4 MEG x 16 ASYNCHRONOUS/PAGE FLASH
67-BALL FBGA
0.80 (TYP)
C L
BALL A1
BALL A1 ID
4.50 ±0.05
47
512K x 16 SRAM COMBO MEMORY
9.00 ±0.10
1.40 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
BALL A1 ID
©2002, Micron Technology, Inc.
ADVANCE