ISP1563BMGA ST-Ericsson Inc, ISP1563BMGA Datasheet - Page 99

• Manufacturer Part Number: ISP1563BMGA
• Description: IC USB HOST CTRL HI-SPD 128LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1563BMGA

• Applications: USB Host/Function Processor
• Interface: EHCI Interface
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 128-LQFP
• Mounting Type: Surface Mount
• For Use With: UM10066 - EVAL BRD FOR ISP1563
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ISP1563BM-S; ISP1563BM-S

Philips Semiconductors
19. Abbreviations
9397 750 14224
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 134: Abbreviations
Acronym
BIOS
CMOS
DID
EEPROM
EHCI
EMI
ESD
HC
HCCA
HCD
OHCI
OS
PCI
PCI-SIG
PLL
PM
PMC
PME
PMCSR
POR
POST
STB
USB
VGA
VID
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Description
Basic Input Output System
Complementary Metal-Oxide Semiconductor
Device ID
Electrically Erasable Programmable Read-Only Memory
Enhanced Host Controller Interface
Electro-Magnetic Interference
Electro-Static Discharge
Host Controller
Host Controller Communication Area
Host Controller Driver
Open Host Controller Interface
Operating System
Peripheral Component Interconnect
PCI-Special Interest Group
Phase-Locked Loop
Power Management
Power Management Capabilities
Power Management Event
Power Management Control/Status
Power-On Reset
Power On Self Test
Set-Top Box
Universal Serial Bus
Video Graphics Array
Vendor ID
Rev. 01 — 14 July 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
HS USB PCI Host Controller
ISP1563
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