TDGL003 Microchip Technology, TDGL003 Datasheet - Page 99

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

11.0
The Universal Serial Bus (USB) module contains ana-
log and digital components to provide a USB 2.0 full-
speed and low-speed embedded host, full-speed
device, or OTG implementation with a minimum of
external components. This module in Host mode is
intended for use as an embedded host and therefore
does not implement a UHCI or OHCI controller.
The USB module consists of the clock generator, the
USB voltage comparators, the transceiver, the Serial
Interface Engine (SIE), a dedicated USB DMA control-
ler, pull-up and pull-down resistors, and the register
interface. A block diagram of the PIC32MX USB OTG
module is presented in
The clock generator provides the 48 MHz clock
required for USB full-speed and low-speed communi-
cation. The voltage comparators monitor the voltage on
the V
transceiver provides the analog translation between
the USB bus and the digital logic. The SIE is a state
machine that transfers data to and from the endpoint
buffers, and generates the hardware protocol for data
transfers. The USB DMA controller transfers data
between the data buffers in RAM and the SIE. The inte-
grated pull-up and pull-down resistors eliminate the
need for external signaling components. The register
interface
communicate with the module.
© 2011 Microchip Technology Inc.
Note 1: This data sheet summarizes the features
BUS
2: Some registers and associated bits
USB ON-THE-GO (OTG)
pin to determine the state of the bus. The
allows
of the PIC32MX3XX/4XX family of
devices. It is not intended to be a compre-
hensive
complement the information in this data
sheet, refer to Section 27. “USB On-
The-Go (OTG)” (DS61126) of the “PIC32
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com/PIC32).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
the
Figure
reference
CPU
11-1.
to
configure
source.
and
To
in
The PIC32MX USB module includes the following
features:
• USB Full-Speed Support for Host and Device
• Low-Speed Host Support
• USB OTG Support
• Integrated Signaling Resistors
• Integrated Analog Comparators for V
• Integrated USB Transceiver
• Transaction Handshaking Performed by
• Endpoint Buffering Anywhere in System RAM
• Integrated DMA to Access System RAM and
Monitoring
Hardware
Flash
Note:
PIC32MX3XX/4XX
The implementation and use of the USB
specifications, as well as other third-party
specifications
require licensing; including, but not limited
to, USB Implementers Forum, Inc. (also
referred to as USB-IF). The user is fully
responsible
satisfying
obligations.
any
for
or
applicable
technologies,
investigating
DS61143H-page 99
BUS
licensing
may
and