TDGL003 Microchip Technology, TDGL003 Datasheet - Page 156

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
TABLE 29-7:
DS61143H-page 156
DC CHARACTERISTICS
Module Differential Current (Continued)
DC43
DC43a
DC43b
DC43h
DC43c
DC43e
DC43f
DC43g
DC43i
Note 1:
Parameter
No.
2:
3:
4:
5:
6:
Base I
pulled low. WDT and FSCM are disabled.
Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The Δ current is the additional current consumed when the module is enabled. This current should be added
to the base I
Test conditions for ADC module differential current are as follows: Internal ADC RC oscillator enabled.
Data is characterized at +70°C and not tested. Parameter is for design guidance only.
This parameter is characterized, but not tested in manufacturing.
Typical
880
—
—
—
—
—
—
—
—
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
(2)
is measured with all digital peripheral modules disabled. All I/Os are configured as inputs and
PD
current.
Max.
1000
1200
1000
1200
1100
1100
1100
1100
—
Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated)
Operating temperature
Units
µA
µA
μA
μA
μA
μA
μA
μA
μA
+105ºC
+105ºC
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
—
2.5V
3.6V
—
-40°C ≤ T
-40°C ≤ T
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Conditions
ADC: ΔI
ADC: ΔI
ADC: ΔI
PD
) (CONTINUED)
© 2011 Microchip Technology Inc.
ADC
ADC
ADC
(Notes 3, 4, 6)
(Notes 3, 4)
(Notes 3, 4)