TDGL003 Microchip Technology, TDGL003 Datasheet - Page 180

ChipKIT Max32 Development Board PIC32 Boards And Kits

TDGL003

Manufacturer Part Number
TDGL003
Description
ChipKIT Max32 Development Board PIC32 Boards And Kits
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Type
MCUr
Datasheets

Specifications of TDGL003

Silicon Manufacturer
Microchip
Core Architecture
MIPS
Core Sub-architecture
PIC32
Silicon Core Number
PIC32MX
Silicon Family Name
PIC32MX795Fxxxx
Kit Contents
Board Only
Contents
Board
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB®, Arduino™ Mega
PIC32MX3XX/4XX
TABLE 29-34: ADC MODULE SPECIFICATIONS (CONTINUED)
DS61143H-page 180
AC CHARACTERISTICS
ADC Accuracy – Measurements with Internal V
AD20d Nr
AD21d INL
AD22d DNL
AD23d G
AD24d E
AD25d
Dynamic Performance
AD31b
AD34b
Note 1:
Param.
No.
2:
3:
4:
Symbol
OFF
SINAD
ERR
ENOB
These parameters are not characterized or tested in manufacturing.
With no missing codes.
These parameters are characterized, but not tested in manufacturing.
Characterized with 1 kHz sinewave.
Resolution
Integral Nonlinearity
Differential Nonlinearity
Gain Error
Offset Error
Monotonicity
Signal to Noise and
Distortion
Effective Number of Bits
Characteristics
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Min.
REF
9.0
55
+/V
REF
10 data bits
-
Typical
58.5
9.5
-40°C ≤ T
-40°C ≤ T
Max.
<±1
<±1
<±2
<±4
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Units
LSb V
LSb V
LSb V
LSb V
bits
bits
dB
© 2011 Microchip Technology Inc.
(Note 3)
AV
(Note 3)
AV
(Notes 2,3)
AV
(Note 3)
AV
(Note 3)
Guaranteed
(Notes 3, 4)
(Notes 3, 4)
INL
INL
INL
INL
DD
DD
DD
DD
= AV
= AV
= AV
= AV
= 2.5V to 3.6V
= 2.5V to 3.6V
= 2.5V to 3.6V
= 2.5V to 3.6V
Conditions
SS
SS
SS
SS
= 0V,
= 0V,
= 0V,
= 0V,

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