TDGL003 Microchip Technology, TDGL003 Datasheet - Page 206

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
TABLE A-2:
DS61143H-page 206
Section 29.0 “Electrical
Characteristics”
Section 30.0 “Packaging Information” Added the 121-pin XBGA package marking information and package
“Product Identification System”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see Table 29-3).
Updated the conditions for parameters DC20, DC21, DC22 and DC23 in
Table 29-5.
Updated the comments for parameter D321 (C
Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure 29-13).
details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Update Description
© 2011 Microchip Technology Inc.
EFC
) in Table 29-15.