TDGL003 Microchip Technology, TDGL003 Datasheet - Page 184

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
FIGURE 29-19:
DS61143H-page 184
ch0_dischrg
ch1_dischrg
Instruction
ch0_samp
ch1_samp
Execution
1 – Software sets ADxCON. ADON to start AD operation.
2 – Sampling starts after discharge period.
3 – Convert bit 9.
4 – Convert bit 8.
5 – Convert bit 0.
6 – One T
7 – Begin conversion of next channel.
8 – Sample for time specified by SAMC<4:0>.
Buffer(0)
Buffer(1)
ADCLK
CONV
SAMP
ADxIF
(DS61104) of the “PIC32 Family Reference Manual”.
eoc
Set ADON
AD
AD50
for end of conversion.
ANALOG-TO-DIGITAL CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS
(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)
1
2
T
SAMP
3
4
AD55
T
SAMP
5
is described in Section 17. “10-bit Analog-to-Digital Converter (ADC)”
6
7
3
4
AD55
5
6
© 2011 Microchip Technology Inc.
T
SAMP
8
3
T
CONV
4