TDGL003 Microchip Technology, TDGL003 Datasheet - Page 213

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2011 Microchip Technology Inc.
Architecture
Product Groups
Flash Memory Family
Program Memory Size
Speed
Pin Count
Temperature Range
Package
Pattern
Flash Memory Family
Microchip Brand
Architecture
Product Groups
Flash Memory Family
Program Memory Size (KB)
Pin Count
Tape and Reel Flag (if applicable)
Speed
Temperature Range
Package
Pattern
MX = 32-bit RISC MCU core
3XX = General purpose microcontroller family
4XX = USB
F
32 = 32K
64 = 64K
128 = 128K
256 = 256K
512 = 512K
40 = 40 MHz
80 = 80 MHz
H
L
I
V
PT = 64-Lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)
BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample
PIC32 MX 3XX F 512 H T - 80 I / PT - XXX
= Flash program memory
= 64-pin
= 100-pin
= -40° C to +85° C (Industrial)
= -40° C to +105° C (V-Temp)
PIC32MX3XX/4XX
Examples:
PIC32MX320F032H-40I/PT:
General purpose PIC32MX,
32 KB program memory,
64-pin, Industrial temperature,
TQFP package.
PIC32MX360F256L-80I/PT:
General purpose PIC32MX,
256 KB program memory,
100-pin, Industrial temperature,
TQFP package.
.
DS61143H-page 213