TDGL003 Microchip Technology, TDGL003 Datasheet - Page 204

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
TABLE A-1:
DS61143H-page 204
Section 26.0 “Special Features” Modified bit names and locations in Register 26-5 “DEVID: Device and
Section 29.0 “Electrical
Characteristics”
Section 30.0 “Packaging
Information”
“Product Identification System” Added the MR package designator for the 64-Lead (9x9x0.9) QFN.
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Revision ID Register”.
Replaced “T
Section 26.3.1 “On-Chip Regulator and POR”.
The information that appeared in the Watchdog Timer and the Programming and
Diagnostics sections of 61143E version of this data sheet has been incorporated
into the Special Features section:
• Section 26.2 “Watchdog Timer (WDT)”
• Section 26.4 “Programming and Diagnostics”
Added the 64-Lead QFN package to Table 29-3.
Updated data in Table 29-5.
Updated data in Table 29-7.
Updated data in Table 29-4, Table 29-5, Table 29-7 and Table 29-8.
Updated data in Table 29-11.
Added OS42 parameter to Table 29-17.
Replaced Table 29-23.
Replaced Table 29-24.
Replaced Table 29-25.
Updated Table 29-36.
Added 64-Lead QFN package marking information to Section 30.1 “Package
Marking Information”.
Added the 64-Lead QFN (MR) package drawing and land pattern to
Section 30.2 “Package Details”.
STARTUP
” with “T
PU
Update Description
”, and “64-ms nominal delay” with “T
© 2011 Microchip Technology Inc.
PWRT
”, in