TDGL003 Microchip Technology, TDGL003 Datasheet - Page 208

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
TABLE A-3:
DS61143H-page 208
Section 29.0 “Electrical
Characteristics”
Section 30.0 “Packaging Information”
Product Identification System
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added the new V-Temp temperature range (-40ºC to +105ºC) to the
heading of all specification tables.
Updated the Ambient temperature under bias, updated the Voltage on
any 5V tolerant pin with respect to V
Voltage on V
Added the characteristic, DC5a to Operating MIPS vs. Voltage (see
Table
Updated or added the following parameters to the Operating Current
(I
Table
Added the following parameters to the Idle Current (I
Characteristics: DC30c, DC31c, DC32c, DS33c, DC34c, DC35c, and
DC36c (see
Added the following parameters to the Power-down Current (I
Characteristics: DC40g, DC40h, DC40i, DC41g, DC41h, DC42g, DC42h,
DC42i, DC43h, and DC43i (see
Added the Brown-out Reset (BOR) Electrical Characteristics (see
Table
Removed all Conditions from the Program Memory DC Characteristics
(see
Removed the AC Characteristics voltage reference table (Table 29-15).
Added Note 2 to the PLL Clock Timing Specifications (see
Updated the OC/PWM Module Timing Characteristics (see
Added parameter IM51 and Note 3 to the I2Cx Bus Data Timing
Requirements (Master Mode) (see
Added parameter numbers (AD13, AD14, and AD15) to the ADC Module
Specifications (see
Updated the 10-bit ADC Conversion Rate Parameters (see
Updated parameter AD57 (T
Timing Requirements (see
Updated the Conditions for parameters USB313, USB318, and USB319
in the OTG Electrical Specifications (see
Updated the 64-Lead Plastic Quad Flat, No Lead Package (MR) –
9x9x0.9 mm Body [QFN] packing diagram.
Added the new V-Temp (V) temperature information.
DD
) DC Characteristics: DC20, DC23, DC24c, DC25d, DC26c (see
Table
29-1).
29-5).
29-10).
29-11).
Table
BUS
with respect to Vss in
29-6).
Table
29-34).
Update Description
Table
SAMP
Table
29-36).
) in the Analog-to-Digital Conversion
Table
SS
29-7).
Absolute Maximum
when V
Table
29-32).
© 2011 Microchip Technology Inc.
DD
29-40).
< 2.3V, and added
IDLE
) DC
Table
Ratings.
Figure
Table
PD
) DC
29-18).
29-35).
29-9).