TDGL003 Microchip Technology, TDGL003 Datasheet - Page 188

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
TABLE 29-40: OTG ELECTRICAL SPECIFICATIONS
DS61143H-page 188
AC CHARACTERISTICS
USB313 V
USB315 V
USB316 V
USB318 V
USB319 VCM
USB320 Z
USB321 V
USB322 V
Note 1:
Param.
No.
Symbol
These parameters are characterized, but not tested in manufacturing.
OUT
OL
OH
USB
ILUSB
IHUSB
DIFS
USB Voltage
Input Low Voltage for USB Buffer
Input High Voltage for USB Buffer
Differential Input Sensitivity
Differential Common Mode Range
Driver Output Impedance
Voltage Output Low
Voltage Output High
Characteristics
(1)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Min.
28.0
3.0
2.0
0.8
0.0
2.8
—
—
Typ
—
—
—
—
—
—
—
—
Max.
44.0
0.2
2.5
0.3
3.6
0.8
3.6
—
-40°C ≤ T
-40°C ≤ T
Units
© 2011 Microchip Technology Inc.
V
V
V
V
V
V
Ω
V
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Voltage on V
be in this range for
proper USB operation.
The difference
between D+ and D-
must exceed this value
while VCM is met.
1.5 kΩ load connected
to 3.6V.
1.5 kΩ load connected
to ground.
Conditions
—
—
—
—
USB
must