TDGL003 Microchip Technology, TDGL003 Datasheet - Page 170

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

PIC32MX3XX/4XX
FIGURE 29-9:
TABLE 29-27: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
DS61143H-page 170
AC CHARACTERISTICS
OC15
OC20
Note 1:
Param
No.
Note: Refer to
OCFA/OCFB
2:
OCx
T
T
These parameters are characterized, but not tested in manufacturing.
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Symbol
FD
FLT
Figure 29-1
OC/PWM MODULE TIMING CHARACTERISTICS
Fault Input to PWM I/O Change
Fault Input Pulse Width
Characteristics
for load conditions.
OC15
OC20
(1)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Min
50
—
OCx is tri-stated
Typical
—
—
(2)
-40°C ≤ T
-40°C ≤ T
Max
25
—
© 2011 Microchip Technology Inc.
A
A
Units
≤ +85°C for Industrial
≤ +105°C for V-Temp
ns
ns
Conditions
—
—