LFXP10C-3F388I Lattice, LFXP10C-3F388I Datasheet - Page 2

• Manufacturer Part Number: LFXP10C-3F388I
• Description: FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 388-Pin FBGA Tray
• Manufacturer: Lattice

Specifications of LFXP10C-3F388I

• Package: 388FBGA
• Family Name: LatticeXP
• Device Logic Units: 10000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 244
• Ram Bits: 221184
• Re-programmability Support: Yes
• Lead Free Status / Rohs Status: Contains lead / RoHS non-compliant

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September 2010
Section I. LatticeXP Family Data Sheet
Introduction
Architecture
DC and Switching Characteristics
Features ............................................................................................................................................................. 1-1
Introduction ........................................................................................................................................................ 1-2
Architecture Overview ........................................................................................................................................ 2-1
Clock Distribution Network ................................................................................................................................. 2-6
Dynamic Clock Select (DCS) ........................................................................................................................... 2-11
sysMEM Memory ............................................................................................................................................. 2-11
Programmable I/O Cells (PICs)........................................................................................................................ 2-14
DDR Memory Support...................................................................................................................................... 2-20
sysIO Buffer ..................................................................................................................................................... 2-22
Sleep Mode ...................................................................................................................................................... 2-25
Configuration and Testing ................................................................................................................................ 2-26
Density Shifting ................................................................................................................................................ 2-28
Absolute Maximum Ratings ............................................................................................................................... 3-1
Recommended Operating Conditions ................................................................................................................ 3-1
Hot Socketing Specifications.............................................................................................................................. 3-2
DC Electrical Characteristics.............................................................................................................................. 3-3
Supply Current (Sleep Mode)............................................................................................................................. 3-3
Supply Current (Standby)................................................................................................................................... 3-4
Initialization Supply Current ............................................................................................................................... 3-5
Programming and Erase Flash Supply Current ................................................................................................. 3-6
sysIO Recommended Operating Conditions...................................................................................................... 3-7
PFU and PFF Blocks................................................................................................................................. 2-2
Slice .......................................................................................................................................................... 2-3
Routing...................................................................................................................................................... 2-6
Primary Clock Sources.............................................................................................................................. 2-6
Secondary Clock Sources......................................................................................................................... 2-7
Clock Routing............................................................................................................................................ 2-8
sysCLOCK Phase Locked Loops (PLLs) .................................................................................................. 2-9
sysMEM Memory Block........................................................................................................................... 2-11
Bus Size Matching .................................................................................................................................. 2-12
RAM Initialization and ROM Operation ................................................................................................... 2-12
Memory Cascading ................................................................................................................................. 2-12
Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-12
Memory Core Reset ................................................................................................................................ 2-13
EBR Asynchronous Reset....................................................................................................................... 2-14
PIO .......................................................................................................................................................... 2-16
DLL Calibrated DQS Delay Block ........................................................................................................... 2-20
Polarity Control Logic .............................................................................................................................. 2-22
Hot Socketing.......................................................................................................................................... 2-25
SLEEPN Pin Characteristics ................................................................................................................... 2-26
IEEE 1149.1-Compliant Boundary Scan Testability................................................................................ 2-26
Device Configuration............................................................................................................................... 2-26
Internal Logic Analyzer Capability (ispTRACY)....................................................................................... 2-27
Oscillator ................................................................................................................................................. 2-27
LatticeXP Family Handbook
1
Table of Contents