TIM5964-60SL Toshiba, TIM5964-60SL Datasheet
TIM5964-60SL
Specifications of TIM5964-60SL
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TIM5964-60SL Summary of contents
Page 1
... X Rth(c-c) SYMBOL CONDITIONS 12. GSoff 200mA DSS -1.0mA GSO GS R Channel to Case th(c-c) TIM5964-60SL UNIT MIN. TYP. MAX. dBm 47.0 48.0 dB 7.5 8.5 ⎯ A 13.2 ⎯ ⎯ dB ⎯ dBc -42 -45 ⎯ ⎯ A ° C ⎯ ⎯ UNIT MIN. TYP. MAX. ⎯ -1.0 -1.8 ⎯ ...
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... CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage Temperature PACKAGE OUTLINE (2-16G1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM5964-60SL SYMBOL UNIT ...
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... RF PERFORMANCE Output Power (Pout) vs. Frequency VDS=10V IDS≅13.2A 49 Pin=39.5dBm 5.8 Output Power(Pout) vs. Input Power(Pin) 51 freq.=6.4GHz 50 V =10V DS I set≅9. TIM5964-60SL 5.9 6.0 6.1 6.2 Frequency(GHz) Pout ηadd 37 39 Pin(dBm) 3 6.3 6.4 6 ...
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... Power Dissipation(PT) vs. Case Temperature(Tc) 200 100 IM3 vs. Power Characteristics -10 V =10V DS I set≅9.5A DS freq.=6.4GHz -20 Δf=5MHz -30 -40 -50 - Pout(dBm) @Single carrier level TIM5964-60SL 80 120 Tc( ° 200 160 40 42 ...