S9S08SG16E1CTJ Freescale, S9S08SG16E1CTJ Datasheet - Page 295

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S9S08SG16E1CTJ

Manufacturer Part Number
S9S08SG16E1CTJ
Description
Manufacturer
Freescale
Datasheet

Specifications of S9S08SG16E1CTJ

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
SCI/SPI
Total Internal Ram Size
1KB
# I/os (max)
16
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
12-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
20
Package Type
TSSOP
Program Memory Type
Flash
Program Memory Size
16KB
Lead Free Status / RoHS Status
Compliant
A.5
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM) and the charge device model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Freescale Semiconductor
ESD Protection and Latch-Up Immunity
1
Latch-up
Parameter is achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted.
Model
Human
Body
No.
1
2
3
Series resistance
Storage capacitance
Number of pulses per pin
Minimum input voltage limit
Maximum input voltage limit
Human body model (HBM)
Charge device model (CDM)
Latch-up current at T
Table A-5. ESD and Latch-Up Protection Characteristics
Table A-4. ESD and Latch-up Test Conditions
Description
Rating
MC9S08SG32 Data Sheet, Rev. 8
1
A
= 125°C
Symbol
Symbol
V
V
I
R1
HBM
CDM
LAT
C
± 2000
± 500
± 100
Min
Value
1500
– 2.5
100
7.5
3
Appendix A Electrical Characteristics
Max
Unit
Unit
mA
pF
Ω
V
V
V
V
295

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