RD38F2240WWYTQ0SB93 Micron Technology Inc, RD38F2240WWYTQ0SB93 Datasheet - Page 52

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RD38F2240WWYTQ0SB93

Manufacturer Part Number
RD38F2240WWYTQ0SB93
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of RD38F2240WWYTQ0SB93

Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Table 24: 48F Type Stacked Components
Table 25: 38F / 48F Density Decoder
Datasheet
52
Package
Designator
PC =
Easy BGA,
RoHS
RC =
Easy BGA,
Leaded
JS =
TSOP, RoHS
TE =
TSOP,
Leaded
PF =
SCSP, RoHS
RD =
SCSP,
Leaded
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
PC
Code
Product Line
Designator
Stacked
NOR Flash
only
48F
No Die
32-Mbit
64-Mbit
128-Mbit
256-Mbit
512-Mbit
1-Gbit
2-Gbit
4-Gbit
8-Gbit
16-Gbit
32-Gbit
64-Gbit
128-Gbit
256-Gbit
512-Gbit
Product Die/
Density
Configuration
Char 1 = Flash
die #1
Char 2 = Flash
die #2
Char 3 = Flash
die #3
Char 4 = Flash
die #4
(See
Table 25,
“38F / 48F
Density
Decoder”
on page 52
for details)
4400
Flash Density
NOR Flash
Product Family
First character
applies to Flash
dies #1 and #2
Second character
applies to Flash
dies #3 and #4
(See
“NOR Flash
Family
Decoder” on
page 53
details)
Table 26,
P0
for
Voltage/NOR
Flash CE#
Configuration
V =
1.8 V Core
and 3 V I/O;
Virtual Chip
Enable
(See
Table 27,
“Voltage /
NOR Flash
CE#
Configurati
on
Decoder”
on
page 53
details)
No Die
4-Mbit
8-Mbit
16-Mbit
32-Mbit
64-Mbit
128-Mbit
256-Mbit
512-Mbit
1-Gbit
2-Gbit
4-Gbit
8-Gbit
16-Gbit
32-Gbit
64-Gbit
V
128-Mbit W18 Family with Synchronous PSRAM
for
Parameter /
Mux
Configuration
B =
Bottom
parameter;
Non-Mux I/O
interface
(See
Table 28,
“Paramete
r / Mux
Configurati
on
Decoder”
on
page 53
details)
B
RAM Density
for
Ballout
Identifier
0 =
Discrete
Ballout
(See
Table 2
9,
“Ballout
Decoder
” on
page 54
for
details)
Order Number: 311760-10
0
November 2007
Device
Details
0 =
Original
released
version of
this
product
0

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