CY8C3446PVI-076 Cypress Semiconductor Corp, CY8C3446PVI-076 Datasheet - Page 95

• Manufacturer Part Number: CY8C3446PVI-076
• Description: PSOC3
• Manufacturer: Cypress Semiconductor Corp
• Series: PSOC™ 3 CY8C34xxr

Specifications of CY8C3446PVI-076

• Package / Case: *
• Voltage - Supply (vcc/vdd): 1.71 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 50MHz
• Number Of I /o: 25
• Eeprom Size: 2K x 8
• Core Processor: 8051
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Program Memory Size: 64KB (64K x 8)
• Data Converters: A/D 2x12b, D/A 2x8b
• Oscillator Type: Internal
• Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
• Connectivity: EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Core Size: 8-Bit
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: SSOP
• Screening Level: Industrial
• Pin Count: 48
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C34
• Core: 8051
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART, USB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 28 to 72
• Number Of Timers: 4
• Operating Supply Voltage: 1.71 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Controller Family/series: (8051) PSOC 3
• No. Of I/o's: 25
• Eeprom Memory Size: 2KB
• Ram Memory Size: 8KB
• Cpu Speed: 50MHz
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Document Number: 001-53304 Rev. *G
LASER MARK
PIN 1 DOT
0.08
SEATING PLANE
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
7
1
0.20 MAX.
1.60 MAX.
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
8
6
8
25
1
Figure 13-3. 68-pin QFN 8 × 8 with 0.4 mm Pitch Package Outline (Sawn Version)
100
26
8.000±0.100
TOP VIEW
Figure 13-4. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline
16.00±0.25 SQ
14.00±0.05 SQ
5
2
3
4
PRELIMINARY
5
1
3
5
SEE DETAIL
76
50
0.900±0.100
12°±1°
(8X)
75
51
1.40±0.05
A
SIDE VIEW
NOTE:
1. JEDEC STD REF MS-026
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
3. DIMENSIONS IN MILLIMETERS
0.50
TYP.
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
STAND-OFF
PSoC
0.200 REF
0.05 MAX
0.15 MAX.
0.05 MIN.
DETAIL
TOP LEFT CORNER CHAMFER
®
5.7±0.10
0.400±0.100
3: CY8C34 Family Datasheet
0.20±0.05
A
0.20 MAX.
R 0.08 MIN.
5
1
3
5
5
2
3
4
0° MIN.
NOTE: PKG. CAN HAVE
SOLDERABLE
EXPOSED
BOTTOM VIEW
6.40 REF
0.400 PITCH
PAD
OR
5.7±0.10
0 0 12.0000
0.60±0.15
0°-7°
4 CORNERS CHAMFER
R 0.08 MIN.
0.20 MAX.
0.25
GAUGE PLANE
001-09618 *C
6
8
1
8
51-85048-*D
1
7
1
Page 95 of 102
PIN1 ID
R 0.20
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