CY8C3446PVI-076 Cypress Semiconductor Corp, CY8C3446PVI-076 Datasheet - Page 93

• Manufacturer Part Number: CY8C3446PVI-076
• Description: PSOC3
• Manufacturer: Cypress Semiconductor Corp
• Series: PSOC™ 3 CY8C34xxr

Specifications of CY8C3446PVI-076

• Package / Case: *
• Voltage - Supply (vcc/vdd): 1.71 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 50MHz
• Number Of I /o: 25
• Eeprom Size: 2K x 8
• Core Processor: 8051
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Program Memory Size: 64KB (64K x 8)
• Data Converters: A/D 2x12b, D/A 2x8b
• Oscillator Type: Internal
• Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
• Connectivity: EBI/EMI, I²C, LIN, SPI, UART/USART, USB
• Core Size: 8-Bit
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: SSOP
• Screening Level: Industrial
• Pin Count: 48
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C34
• Core: 8051
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART, USB
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 28 to 72
• Number Of Timers: 4
• Operating Supply Voltage: 1.71 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Controller Family/series: (8051) PSOC 3
• No. Of I/o's: 25
• Eeprom Memory Size: 2KB
• Ram Memory Size: 8KB
• Cpu Speed: 50MHz
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13. Packaging
Table 13-1. Package Characteristics
Table 13-2. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Document Number: 001-53304 Rev. *G
T
T
Tja
Tja
Tja
Tja
Tjc
Tjc
Tjc
Tjc
A
J
Parameter
Operating ambient temperature
Operating junction temperature
Package θJA (48-pin SSOP)
Package θJA (48-pin QFN)
Package θJA (68-pin QFN)
Package θJA (100-pin TQFP)
Package θJC (48-pin SSOP)
Package θJC (48-pin QFN)
Package θJC (68-pin QFN)
Package θJC (100-pin TQFP)
Pb-free assemblies (20s to 40s) –
Sn-Ag-Cu solder paste reflow
temperature
Pb-free assemblies (20s to 40s) –
Sn-Pb solder paste reflow
temperature
100-pin TQFP
48-pin SSOP
48-pin QFN
68-pin QFN
Package
Description
PRELIMINARY
Conditions
PSoC
MSL 1
MSL 3
MSL 3
MSL 3
MSL
®
3: CY8C34 Family Datasheet
Min
–40
–40
235
205
–
–
–
–
–
–
–
–
25.00
45.16
15.94
30.52
27.84
11.72
7.05
6.32
9.04
Typ
–
–
–
Max
100
245
220
85
–
–
–
–
–
–
–
–
Page 93 of 102
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Units
°C
°C
°C
°C
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