PIC18C658-I/PT Microchip Technology, PIC18C658-I/PT Datasheet - Page 348

• Manufacturer Part Number: PIC18C658-I/PT
• Description: 32 KB OTP, 1536 RAM, 52 I/O 64 TQFP 10x10x1mm TRAY
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C658-I/PT

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TFQFP
• Processor Series: PIC18C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1536 B
• Interface Type: 3-Wire, I2C, SPI, USART, CAN
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 4 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163007, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC18C658I/PT

PIC18CXX8
84-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30475A-page 348
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-093
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E
E1
1
2
CH1 x 45
Units
CH2
CH1
E2
D2
A2
A1
A3
E1
D1
B1
n1
D
n
p
A
E
c
B
Advanced Information
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.045
.005
.050
.173
.153
.028
.029
.990
.990
.954
.954
.920
.920
.029
.020
.011
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
25.02
25.02
24.13
24.13
22.61
22.61
4.19
3.68
1.02
0.00
0.20
0.66
0.33
0.51
0.61
D2
0
0
MILLIMETERS
p
NOM
2000 Microchip Technology Inc.
25.15
25.15
24.23
24.23
23.37
23.37
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
68
17
5
5
MAX
A1
25.27
25.27
24.33
24.33
23.62
23.62
4.06
4.57
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10