HD6417032F20 Renesas Electronics America, HD6417032F20 Datasheet - Page 205

IC SUPERH MPU ROMLESS 112QFP

HD6417032F20

Manufacturer Part Number
HD6417032F20
Description
IC SUPERH MPU ROMLESS 112QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7030r
Datasheet

Specifications of HD6417032F20

Core Processor
SH-1
Core Size
32-Bit
Speed
20MHz
Connectivity
EBI/EMI, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
32
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
112-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-

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2. Bus release procedure
c. Refresh cycle + bus cycle
The bus release procedure is shown in figure 8.47. Figure 8.47 shows the case where BREQ is
input one state before the break between bus cycles so that tBRQS is satisfied. In the SH7032
and SH7034, the bus is released after the bus cycle in which BREQ is input (if BREQ is input
between bus cycles, after the bus cycle starting next).
The bus is never released during a refresh cycle and the following bus cycle ((a) or (b)
above)) (figure 8.46).
RAS, CAS
A21 to A0
RD, WR
BREQ
BACK
CSn
CK
Figure 8.46 Refresh Cycle and Following Bus Cycle
t
BRQS
Bus cycle
The bus is released after the bus
cycle in which BREQ is input
(if BREQ is input between bus cycles,
after the bus cycle starting next).
Figure 8.47 Bus Release Procedure
Refresh cycle
Cycle during which bus
is not released
high-level output
Strobe pin:
t
t
BZD
BZD
1 bus cycle
t
BACD1
Rev. 7.00 Jan 31, 2006 page 177 of 658
high impedance
Address & data
strobe pins:
Section 8 Bus State Controller (BSC)
t
Bus release
BRQS
t
BACD2
Bus cycle restart
Bus cycle
REJ09B0272-0700

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