UPD70F3735GC-GAD-AX Renesas Electronics America, UPD70F3735GC-GAD-AX Datasheet - Page 790

• Manufacturer Part Number: UPD70F3735GC-GAD-AX
• Description: MCU 32BIT V850ES/JX3-L 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3735GC-GAD-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 66
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JF3-L
(b) CLKOUT synchronous
(T
Remark The values in the above specifications are values for when clocks with a 1:1 duty ratio are input from X1.
Bus Hold (CLKOUT Synchronous)
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
A
Address bus (output)
HLDRQ setup time (to CLKOUT↓)
HLDRQ hold time (from CLKOUT↓)
Delay time from CLKOUT↑ to bus float
Delay time from CLKOUT↑ to HLDAK
= −40 to +85°C, V
WR0, WR1 (output)
CLKOUT (output)
HLDAK (output)
HLDRQ (input)
Data bus (I/O)
ASTB (output)
RD (output),
Parameter
DD
= EV
<89>
T2
DD
<90>
= AV
REF0
T3
= AV
t
t
t
t
SHQK
HKHQ
DKF
DKHA
REF1
Symbol
= 2.7 to 3.6 V, V
TI
<91>
<89>
<90>
<91>
<92>
<92>
TH
CHAPTER 30 ELECTRICAL SPECIFICATIONS
SS
Conditions
= EV
TH
SS
= AV
Hi-Z
Hi-Z
Hi-Z
<89>
SS
TH
= 0 V, C
MIN.
20
5
<92>
L
= 50 pF)
TI
MAX.
19
19
Page 774 of 816
Unit
ns
ns
ns
ns