MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 635

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

17.4.2.3
The global memory spaces reserved for the internal resources (RAM, EEPROM, and FLASH) are not
determined by the MMC module. Size of the individual internal resources are however fixed in the design
of the device cannot be changed by the user. Please refer to the Device User Guide for further details.
Figure 17-23
the memory spaces have fixed top addresses.
Freescale Semiconductor
Bit22
Bit22
1
2
3
RAMSIZE is the hexadecimal value of RAM SIZE in bytes
EEPROMSIZE is the hexadecimal value of EEPROM SIZE in bytes
FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes
Internal Resource
and
Implemented Memory Map
EEPROM
Registers
BDMGPR Register [6:0]
Table 17-20
BDMGPR Register [6:0]
FLASH
RAM
Table 17-19. Global Implemented Memory Space
show the memory spaces occupied by the on-chip resources. Please note that
Figure 17-22. BDMGPR Address Mapping
MC9S12XDP512 Data Sheet, Rev. 2.21
$14_0000 minus EEPROMSIZE
$80_0000 minus FLASHSIZE
BDM HARDWARE COMMAND
$10_0000 minus RAMSIZE
BDM FIRMWARE COMMAND
Global Address [22:0]
Global Address [22:0]
Bit16
Bit16
Bottom Address
Bit15
Bit15
$00_0000
1
3
Chapter 17 Memory Mapping Control (S12XMMCV2)
BDM Local Address
2
CPU Local Address
Top Address
$0F_FFFF
$13_FFFF
$7F_FFFF
$00_07FF
Bit0
Bit0
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