MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 334

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 7 Enhanced Capture Timer (S12ECT16B8CV2)
7.3.2.16
Read: Anytime
Write used in the flag clearing mechanism. Writing a one to the flag clears the flag. Writing a zero will not
affect the current status of the bit.
All bits reset to zero.
PAFLG indicates when interrupt conditions have occurred. The flags can be cleared via the normal flag
clearing mechanism (writing a one to the flag) or via the fast flag clearing mechanism (Reference TFFCA
bit in
7.3.2.17
334
PAOVF
Reset
Reset
Field
PAIF
1
0
Section 7.3.2.6, “Timer System Control Register 1
W
W
R
R
PACNT7(15) PACNT6(14) PACNT5(13) PACNT4(12) PACNT3(11) PACNT2(10)
Pulse Accumulator A Overflow Flag — Set when the 16-bit pulse accumulator A overflows from 0xFFFF to
0x0000, or when 8-bit pulse accumulator 3 (PAC3) overflows from 0x00FF to 0x0000.
When PACMX = 1, PAOVF bit can also be set if 8-bit pulse accumulator 3 (PAC3) reaches 0x00FF followed by
an active edge on PT3.
Pulse Accumulator Input edge Flag — Set when the selected edge is detected at the PT7 input pin. In event
mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at
the PT7 input pin triggers PAIF.
Pulse Accumulator A Flag Register (PAFLG)
Pulse Accumulators Count Registers (PACN3 and PACN2)
0
0
0
7
7
When TFFCA = 1, the flags cannot be cleared via the normal flag clearing
mechanism (writing a one to the flag). Reference
System Control Register 1
= Unimplemented or Reserved
Figure 7-37. Pulse Accumulators Count Register 3 (PACN3)
Figure 7-36. Pulse Accumulator A Flag Register (PAFLG)
0
0
0
6
6
Table 7-21. PAFLG Field Descriptions
MC9S12XDP512 Data Sheet, Rev. 2.21
0
0
0
5
5
(TSCR1)”.
NOTE
0
0
0
4
4
Description
(TSCR1)”).
0
0
0
3
3
Section 7.3.2.6, “Timer
0
0
0
2
2
PACNT1(9)
PAOVF
Freescale Semiconductor
0
0
1
1
PACNT0(8)
PAIF
0
0
0
0