MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 624

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 17 Memory Mapping Control (S12XMMCV2)
17.3.2.6
Read: Anytime
Write: Anytime
The RAM page index register allows accessing up to (1M minus 2K) bytes of RAM in the global memory
map by using the eight page index bits to page 4 Kbyte blocks into the RAM page window located in the
CPU local memory map from address $1000 to address $1FFF (see
624
Address: 0x0016
Reset
W
R
1
2
Internal means resources inside the MCU are read/written.
Internal Flash means Flash resources inside the MCU are read/written.
Emulation memory means resources inside the emulator are read/written (PRU registers, flash
replacement, RAM, EEPROM and register space are always considered internal).
External application means resources residing outside the MCU are read/written.
The external access stretch mechanism is part of the EBI module (refer to EBI Block Guide for details).
Emulation Single Chip
Emulation Expanded
RP7
Special Single Chip
Normal Single Chip
RAM Page Index Register (RPAGE)
Normal Expanded
1
7
XGATE write access to this register during an CPU access which makes use
of this register could lead to unexpected results.
Chip Modes
Special Test
Table 17-10. Data Sources when CPU or BDM is Accessing Flash Area
RP6
1
6
Figure 17-11. RAM Page Index Register (RPAGE)
MC9S12XDP512 Data Sheet, Rev. 2.21
RP5
ROMON
1
5
X
X
X
0
1
0
1
1
0
1
CAUTION
RP4
EROMON
1
4
X
X
X
X
X
X
0
1
0
1
RP3
1
3
External Application
External Application
External Application
Emulation Memory
Emulation Memory
DATA SOURCE
Internal Flash
Internal Flash
Internal Flash
Internal Flash
Figure
Internal
RP2
1
2
1-12).
1
Freescale Semiconductor
RP1
0
1
Stretch
N
N
N
N
N
Y
Y
2
RP0
1
0