MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 400

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 9 Inter-Integrated Circuit (IICV2) Block Description
The number of clocks from the falling edge of SCL to the first tap (Tap[1]) is defined by the values shown
in the scl2tap column of
tap2tap column in
to determine the delay from the falling edge of SCL to SDA changing, the SDA hold time.
IBC7–6 defines the multiplier factor MUL. The values of MUL are shown in the
The equation used to generate the divider values from the IBFD bits is:
400
SCL
SDA
SCL Divider = MUL x {2 x (scl2tap + [(SCL_Tap -1) x tap2tap] + 2)}
SDA
SCL
START condition
Table
Table
9-3. The SCL Tap is used to generated the SCL period and the SDA Tap is used
9-3, all subsequent tap points are separated by 2
Figure 9-5. SCL Divider and SDA Hold
MC9S12XDP512 Data Sheet, Rev. 2.21
SCL Hold(start)
Table 9-4. Multiplier Factor
IBC7-6
00
01
10
11
SCL Divider
RESERVED
MUL
01
02
04
STOP condition
SDA Hold
IBC5-3
Table
Freescale Semiconductor
as shown in the
SCL Hold(stop)
9-4.