MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 585

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The receive cases are more complicated.
system. Since the host is asynchronous to the target, there is up to one clock-cycle delay from the
host-generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the
BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must
release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the
perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it
started the bit time.
Freescale Semiconductor
Start of Bit Time
Start of Bit Time
Target System
(Target MCU)
(Target MCU)
BDM Clock
BDM Clock
BKGD Pin
BKGD Pin
Transmit 1
Transmit 0
Perceived
Perceived
Speedup
Drive to
Pulse
Host
Host
Host
Synchronization
Uncertainty
Figure 15-9. BDM Target-to-Host Serial Bit Timing (Logic 1)
High-Impedance
Figure 15-8. BDM Host-to-Target Serial Bit Timing
MC9S12XDP512 Data Sheet, Rev. 2.21
10 Cycles
R-C Rise
Figure 15-9
10 Cycles
10 Cycles
Target Senses Bit
shows the host receiving a logic 1 from the target
Host Samples
High-Impedance
Chapter 15 Background Debug Module (S12XBDMV2)
BKGD Pin
High-Impedance
Next Bit
Earliest
Start of
Next Bit
Earliest
Start of
585