D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 824

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
Table 17.73 (2) Usable Area for Erasure in User Program Mode
Rev.7.00 Feb. 14, 2007 page 790 of 1108
REJ09B0089-0700
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Inhibit of
Interrupt
Operation for Writing H'5A
to Key Register
Operation for Settings of
Erasure Parameter
Execution of Erasure
Judgement of Erasure
Result
Operation for Erasure
Error
Operation for Key Register
Clear
Item
On-Chip
RAM
Storable/Executable Area
User
MAT
×
×
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
User
MAT
Selected MAT
Storage Area
Embedded
Program

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