D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 77

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
2.6.2
Table 2.2 indicates the combinations of instructions and addressing modes that the H8S/2600 CPU
can use.
Table 2.2
Legend:
Size refers to the operand size.
B: Byte
W: Word
L: Longword
Notes: 1. Cannot be used in the H8S/2319 Group.
Data
transfer
Arithmetic
operations
Logic
operations
Shift
Bit manipulation
Branch
System
control
Block data transfer
Function
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
MOV
POP, PUSH
LDM, STM
MOVFPE,
MOVTPE *
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
DIVXU
MULXS,
DIVXS
NEG
EXTU, EXTS
TAS *
AND, OR,
XOR
NOT
Bcc, BSR
JMP, JSR
RTS
TRAPA
RTE
SLEEP
LDC
STC
ANDC,
ORC, XORC
NOP
Instructions and Addressing Modes
Instruction
Combinations of Instructions and Addressing Modes
2
1
BWL
BWL
BWL
WL
B
B
B
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BW
BW
WL
B
B
B
B
B
L
BWL
W
W
B
B
BWL
W
W
BWL
W
W
BWL
W
W
Addressing Modes
B
B
Rev.7.00 Feb. 14, 2007 page 43 of 1108
BWL
W
W
B
B
BWL
W
W
B
REJ09B0089-0700
Section 2 CPU
WL
BW
L

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