D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 16

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Item
20.3.6 Flash Memory
Characteristics
Table 20.29 Flash
Memory
Characteristics
Appendix E Products
Lineup
Table E.1 H8S/2319
Group Products Lineup
F. Package
Dimensions
Figure F.4 TLP-113V
Package Dimensions
All trademarks and registered trademarks are the property of their respective owners.
Rev.7.00 Feb. 14, 2007 page xiv of xxxii
REJ09B0089-0700
Page
860
1103
1104
Revision (See Manual for Details)
Table 20.29 amended
Note 5 added
Note: 5. Reference value for 25°C (as a guideline, rewriting
should normally function up to this value).
Table E.1 amended
HD64F2319E*
H8S/2317(S)*
Notes amended
Notes: 1. The on-chip debug function can be used with the
E10A emulator (E10A compatible version).
2. H8S/2317S in mask ROM version.
Figure F.4 replaced
Item
Number of overwrites
Data retention time *
4
2
1
Symbol
t
NWEC
DRP
Min
100 *
10
3
Typ
10000 *
5
Max
Times
Unit
Years
Test Conditions

Related parts for D12312SVF20V