D12312SVF20V Renesas Electronics America, D12312SVF20V Datasheet - Page 722

IC H8S/2312S MCU ROMLESS 100QFP

D12312SVF20V

Manufacturer Part Number
D12312SVF20V
Description
IC H8S/2312S MCU ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVF20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12312SVF20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 ROM
17.22.2 Overview
(1) Block Diagram
Rev.7.00 Feb. 14, 2007 page 688 of 1108
REJ09B0089-0700
Note: To read from or write to any of the registers above except RAMER, the FLSHE bit
Mode pin
in system control register 2 (SYSCR2) must be set to 1.
Legend:
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
RAMER: RAM emulation register
Flash code control and status register
Flash program code select register
Flash erase code select register
Flash key code register
FMATS
FTDAR
RAMER
Figure 17.60 Block Diagram of Flash Memory
FCCS
FPCS
FECS
FKEY
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
User MAT: 512 kbytes
User boot MAT: 8 kbytes
Memory MAT unit

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