MC9S12XET256CAG Freescale Semiconductor, MC9S12XET256CAG Datasheet - Page 297

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MC9S12XET256CAG

Manufacturer Part Number
MC9S12XET256CAG
Description
MCU 16BIT 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XET256CAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XE
Core
HCS12
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12XET256CAG
Manufacturer:
FREESCALE
Quantity:
1 701
Part Number:
MC9S12XET256CAG
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XET256CAG
Manufacturer:
FREESCALE
Quantity:
1 701
Freescale Semiconductor
Start of Bit Time
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
Target System
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
(Target MCU)
BDM Clock
BKGD Pin
BKGD Pin
Perceived
Speedup
Drive to
Pulse
Host
Figure 7-9. BDM Target-to-Host Serial Bit Timing (Logic 1)
High-Impedance
MC9S12XE-Family Reference Manual Rev. 1.23
10 Cycles
R-C Rise
10 Cycles
High-Impedance
Host Samples
BKGD Pin
Chapter 7 Background Debug Module (S12XBDMV2)
High-Impedance
Next Bit
Earliest
Start of
297

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