S9S12P64J0MFT Freescale Semiconductor, S9S12P64J0MFT Datasheet - Page 143
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S9S12P64J0MFT
Manufacturer Part Number
S9S12P64J0MFT
Description
MCU 64K FLASH AUTO 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.S9S12P32J0MFT.pdf
(566 pages)
Specifications of S9S12P64J0MFT
Core Processor
HCS12
Core Size
16-Bit
Speed
32MHz
Connectivity
CAN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-QFN Exposed Pad
Processor Series
S12P
Core
HCS12
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, DEMO9S12PFAME
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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5.4.6
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode
select input which selects between normal and special modes of operation. After reset, this pin becomes
the dedicated serial interface pin for the BDM.
The BDM serial interface is timed based on the VCO clock (please refer to the CPMU Block Guide for
more details), which gets divided by 8.
explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on
the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is
transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per
bit. The interface times out if 512 clock cycles occur between falling edges from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all
times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically
drive the high level. Since R-C rise time could be unacceptably long, the target system and host provide
brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host
for transmit cases and the target for receive cases.
The timing for host-to-target is shown in
Figure
the host and target are operating from separate clocks, it can take the target system up to one full clock
cycle to recognize this edge. The target measures delays from this perceived start of the bit time while the
host measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
Freescale Semiconductor
Hardware
Hardware
Firmware
Firmware
5-9. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Since
TRACE
Read
Read
Write
Write
GO,
BDM Serial Interface
AT ~16 TC/Bit
Command
Command
Command
Command
Command
8 Bits
DELAY
48-BC
76-BC
Delay
AT ~16 TC/Bit
S12P-Family Reference Manual, Rev. 1.13
Figure 5-6. BDM Command Structure
Address
Address
16 Bits
Data
Command
This clock will be referred to as the target clock in the following
Next
Data
Figure 5-7
DELAY
36-BC
and that of target-to-host in
150-BC
Delay
Command
Command
Next
Next
Data
AT ~16 TC/Bit
16 Bits
Background Debug Module (S12SBDMV1)
Data
BC = Bus Clock Cycles
TC = Target Clock Cycles
150-BC
Delay
Figure 5-8
Command
Command
Next
Next
and
143
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