P89CV51RD2FBC,557 NXP Semiconductors, P89CV51RD2FBC,557 Datasheet - Page 57

IC 80C51 MCU FLASH 64K 44-TQFP

P89CV51RD2FBC,557

Manufacturer Part Number
P89CV51RD2FBC,557
Description
IC 80C51 MCU FLASH 64K 44-TQFP
Manufacturer
NXP Semiconductors
Series
89Cr
Datasheet

Specifications of P89CV51RD2FBC,557

Core Processor
8051
Core Size
8-Bit
Speed
40MHz
Connectivity
EBI/EMI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Processor Series
P89CV5x
Core
80C51
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
4.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Minimum Operating Temperature
- 40 C
Cpu Family
89C
Device Core
80C51
Device Core Size
8b
Frequency (max)
40MHz
Total Internal Ram Size
1KB
# I/os (max)
32
Number Of Timers - General Purpose
3
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details
Other names
568-4257
935284103557
P89CV51RD2FBC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
P89CV51RD2FBC,557
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
P89CV51RB2_RC2_RD2_3
Product data sheet
6.13.1 Clock input options and recommended capacitor values for oscillator
6.13 System clock and clock options
Shown in
amplifier (XTAL1, XTAL2), which can be configured for use as an on-chip oscillator.
When driving the device from an external clock source, XTAL2 should be left disconnected
and XTAL1 should be driven.
At start-up, the external oscillator may encounter a higher capacitive load at XTAL1 due to
interaction between the amplifier and its feedback capacitance. However, the capacitance
will not exceed 15 pF once the external signal meets the V
Resonator manufacturer, supply voltage, and other factors may cause circuit performance
to differ from one application to another. C
each design.
various frequencies.
Table 49.
Resonator
Quartz
Ceramic
Fig 26. Oscillator characteristics (using the on-chip oscillator)
Fig 27. Oscillator characteristics (external clock drive)
Figure 26
Recommended values for C
Table 49
and
Rev. 03 — 25 August 2009
shows the typical values for C
Figure 27
C 2
C 1
oscillator
external
are the input and output of an internal inverting
signal
1
n.c.
and C
P89CV51RB2/RC2/RD2
XTAL2
XTAL1
V
SS
1
and C
2
C
20 pF to 30 pF
40 pF to 50 pF
by crystal type
1
= C
002aaa546
XTAL2
XTAL1
V
2
SS
should be adjusted appropriately for
2
1
and C
IL
002aaa545
2
and V
80C51 with 1 kB RAM, SPI
versus resonator type for
IH
specifications.
© NXP B.V. 2009. All rights reserved.
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