P89CV51RD2FBC,557 NXP Semiconductors, P89CV51RD2FBC,557 Datasheet - Page 2

• Manufacturer Part Number: P89CV51RD2FBC,557
• Description: IC 80C51 MCU FLASH 64K 44-TQFP
• Manufacturer: NXP Semiconductors
• Series: 89Cr

Specifications of P89CV51RD2FBC,557

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: P89CV5x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• Cpu Family: 89C
• Device Core: 80C51
• Device Core Size: 8b
• Frequency (max): 40MHz
• Total Internal Ram Size: 1KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: TQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4257; 935284103557; P89CV51RD2FBC

NXP Semiconductors
3. Ordering information
P89CV51RB2_RC2_RD2_3
Product data sheet
2.3 Comparison to P89C51RB2/RC2/RD2 devices
3.1 Ordering options
I
I
I
I
I
I
I
Table 1.
Table 2.
Type number
P89CV51RB2FA
P89CV51RB2FBC
P89CV51RC2FA
P89CV51RC2FBC
P89CV51RD2FA
P89CV51RD2FBC
Type number
P89CV51RB2FA
P89CV51RB2FBC
P89CV51RC2FA
P89CV51RC2FBC
P89CV51RD2FA
P89CV51RD2FBC
Power-down mode with external interrupt wake-up
Idle mode
SPI: The P89CV51RB2/RC2/RD2 devices have an SPI interface that was not present
on the P89C51RB2/RC2/RD2 devices.
Smaller block size: The page size decreased from 4 kB to 128 B. These smaller
pages can be erased and reprogrammed using IAP function calls, which makes
practical use of code memory for non-volatile data storage. A page is erased in 30 ms
or less. IAP and ISP code both support 128-B page operations. The IAP and ISP code
uses multiple page-erase operations to emulate the erasing of larger block sizes (8 kB
and 16 kB) to maintain firmware compatibility.
Status bit replaces Status byte: Automatic entry into ISP mode following a reset is
now controlled by one status bit. Its operation is almost identical to that used by the
previous devices, which was based on the zero/non-zero value of the status byte.
Faster block erase: The erase time for the entire user-code memory of the
P89CV51RB2/RC2/RD2 devices is 150 ms, which is a significant improvement.
Larger RAM size: RAM size increased from 512 B to 1 kB.
Ordering information
Ordering options
Package
Name
PLCC44
TQFP44
PLCC44
TQFP44
PLCC44
TQFP44
Rev. 03 — 25 August 2009
Flash
memory
16 kB
32 kB
64 kB
Description
plastic leaded chip carrier; 44 leads
plastic thin quad flat package; 44 leads; body
10
plastic leaded chip carrier; 44 leads
plastic thin quad flat package; 44 leads; body
10
plastic leaded chip carrier; 44 leads
plastic thin quad flat package; 44 leads; body
10
10
10
10
RAM
1 kB
1 kB
1 kB
P89CV51RB2/RC2/RD2
1.0 mm
1.0 mm
1.0 mm
Temperature
range
40 C to +85 C
80C51 with 1 kB RAM, SPI
© NXP B.V. 2009. All rights reserved.
Frequency
0 MHz to 40 MHz
Version
SOT187-2
SOT376-1
SOT187-2
SOT376-1
SOT187-2
SOT376-1
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