ATSAM3U2EA-AU Atmel, ATSAM3U2EA-AU Datasheet - Page 1147

IC MCU 32BIT 128KB FLASH 144LQFP

ATSAM3U2EA-AU

Manufacturer Part Number
ATSAM3U2EA-AU
Description
IC MCU 32BIT 128KB FLASH 144LQFP
Manufacturer
Atmel
Series
SAM3Ur
Datasheets

Specifications of ATSAM3U2EA-AU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
96MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
36K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b, 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Controller Family/series
SAM3U
No. Of I/o's
96
Ram Memory Size
36KB
Cpu Speed
96MHz
No. Of Timers
3
Rohs Compliant
Yes
Processor Series
ATSAM3x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
36 KB
Interface Type
4xUSART, 2xTWI, 5xSPI, Bus
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
96
Number Of Timers
8
Operating Supply Voltage
1.62 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3U-EK
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3U2EA-AU
Manufacturer:
Atmel
Quantity:
10 000
44.5
44.6
6430D–ATARM–25-Mar-11
Soldering Profile
Packaging Resources
Table 44-15
Table 44-15. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
3° C/sec. max.
180 sec. max.
Green Package
60 sec. to 150 sec.
20 sec. to 40 sec.
260° C
6° C/sec. max.
8 min. max.
SAM3U Series
1147

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