S71GL256NB0 SPANSION [SPANSION], S71GL256NB0 Datasheet - Page 124

• Manufacturer Part Number: S71GL256NB0
• Description: Stacked Multi-chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

Address Patterns for PASR (A4=1) (64M)
Deep ICC Characteristics (for 64Mb)
Address Patterns for PAR (A3= 0, A4=1) (32M)
124
A2 A1
A2
1
1
1
1
0
0
0
0
0
0
x
1
1
PASR Mode Standby Current
Deep Sleep Current
Temperature Compensated Refresh Current
A1
1
1
0
0
1
1
0
0
1
1
0
1
1
Item
A0
A0
1
0
1
0
1
0
1
0
1
0
0
1
0
Item
One-quarter of die
One-half of die
Full die
One-quarter of die
One-half of die
Bottom quarter of die
Item
Top quarter of die
Bottom half of die
Top half of die
Active Section
Active Section
Symbol
Reserved
Reserved
Full array
No PASR
I
ZZ
Symbol
I
PASR
V
IN
V
A d v a n c e
= V
IN
= V
CC
pSRAM Type 1
or 0V, Chip Disabled, t
CC
Symbol
000000h - 07FFFFh
000000h - 0FFFFFh
000000h - 1FFFFFh
180000h - 1FFFFFh
100000h - 1FFFFFh
I
or 0V, Chip in ZZ# mode, t
TCR
Test
300000h-3FFFFFh
200000h-3FFFFFh
000000h-0FFFFFh
000000h-1FFFFFh
000000h-3FFFFFh
I n f o r m a t i o n
Address Space
Max Temperature
Test
Address Space
None
15°C
45°C
70°C
85°C
A
= 85°C
A
= 25°C
Array Partition Typ
Typ
1/4 Array
1/2 Array
Full Array
None
pSRAM_Type01_12_A1 August 30, 2004
Max
120
512Kb x 16
512Kb x 16
50
60
80
1Mb x 16
2Mb x 16
1Mb x 16
2Mb x 16
4Mb x 16
1Mb x 16
2Mb x 16
1Mb x 16
Typ
Size
Size
0
Max
10
Max
120
10
60
80
Unit
µA
Density
Density
16Mb
32Mb
16Mb
32Mb
64Mb
16Mb
32Mb
16Mb
8Mb
8Mb
Unit
0
Unit
µA
µA