MT29F4G08ABBDAH4:D Micron Technology Inc, MT29F4G08ABBDAH4:D Datasheet - Page 132

• Manufacturer Part Number: MT29F4G08ABBDAH4:D
• Description: MICMT29F4G08ABBDAH4:D 4G SLC NAND FLASH
• Manufacturer: Micron Technology Inc

Rev. B, Advance – 10/09
Rev. A, Advance – 7/09
PDF: 09005aef83b25735
m60a_4gb_nand.pdf – Rev. J 9/11 EN
Although considered final, these specifications are subject to change, as further product development and data characterization some-
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
• Added Bare Die Parameter Page Data Structure Table
• Removed Boot Block
• Removed part numbers: MT29F4G08ABBDAWP and MT29F4G16ABBDAWP
• Updated "Internal Data Move with Internal ECC Enabled" graphic spec from
• Updated "Internal Data Move with Random Data Input with Internal ECC Enabled"
• Updated Boot Block Operation to include dual-plane restrictions
• Added
• Added note for
• Moved note from
• Initial release
www.micron.com/productsupport Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
Micron and the Micron logo are trademarks of Micron Technology, Inc.
MT29F4G08ABBDA Value: 56h, MT29F4G16ABBDA Value: 56h; Removed H4 from
part numbers
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graphic spec from
Program/Erase Characteristics
R_ECC
All other trademarks are the property of their respective owners.
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RCBSY spec to Electrical Specifications - Program/Erase Characteristics
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PROG and
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RHW to
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R to
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4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
times occur.
R_ECC
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132
RHZ in AC Characteristics and Operating Conditions
PROG_ECC specifications to Electrical Specifications -
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
Revision History
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