MPC8544DS Freescale Semiconductor, MPC8544DS Datasheet - Page 81

• Manufacturer Part Number: MPC8544DS
• Description: BOARD DEVELOPMENT SYSTEM 8544
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8544DS

• Contents: Board
• Processor To Be Evaluated: MPC8544E
• Data Bus Width: 32 bit
• Interface Type: Ethernet, I2C
• Operating Supply Voltage: - 0.3 V to + 1.1 V
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• For Use With/related Products: MPC8544
• For Use With: PPC8544EVTANG - EVAL MPC8544 783FCPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
Freescale Semiconductor
Package Parameters for the MPC8544E FC-PBGA
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Table 61. Package Parameters
Parameter
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Table
Package Description
61.
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