MPC8544DS Freescale Semiconductor, MPC8544DS Datasheet - Page 102

• Manufacturer Part Number: MPC8544DS
• Description: BOARD DEVELOPMENT SYSTEM 8544
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8544DS

• Contents: Board
• Processor To Be Evaluated: MPC8544E
• Data Bus Width: 32 bit
• Interface Type: Ethernet, I2C
• Operating Supply Voltage: - 0.3 V to + 1.1 V
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• For Use With/related Products: MPC8544
• For Use With: PPC8544EVTANG - EVAL MPC8544 783FCPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure
interface pressure.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
102
61). Therefore, the synthetic grease offers the best thermal performance, especially at the low
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation800-248-2481
Corporate Center
P.O.Box 999
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company800-347-4572
18930 West 78
1.5
0.5
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
2
1
0
Figure 63. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
20
Contact Pressure (psi)
30
40
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
Freescale Semiconductor
80