MCP6V01DM-VOS Microchip Technology, MCP6V01DM-VOS Datasheet - Page 41

• Manufacturer Part Number: MCP6V01DM-VOS
• Description: DEMO BOARD FOR MCP6V01
• Manufacturer: Microchip Technology

Specifications of MCP6V01DM-VOS

• Channels Per Ic: 1 - Single
• Amplifier Type: Chopper (Zero-Drift)
• Output Type: Rail-to-Rail
• Slew Rate: 0.5 V/µs
• Current - Output / Channel: 22mA
• Operating Temperature: -40°C ~ 125°C
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: MCP6V01
• Silicon Manufacturer: Microchip
• Application Sub Type: Operational Amplifier
• Kit Application Type: Amplifier
• Silicon Core Number: MCP6V01, MCP6V03, MCP6V06, MCP6V08
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Current - Supply (main Ic): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2008 Microchip Technology Inc.
PART NO.
Device:
Temperature Range:
Package:
Device
Temperature
Range
–X
MCP6V01
MCP6V01T Single Op Amp
MCP6V02
MCP6V02T Dual Op Amp
MCP6V03
MCP6V03T Single Op Amp with Chip Select
E
MD
MNY * = Plastic Dual Flat No Lead (2x3x0.75 mm), 8-lead
SN
* Y = nickel palladium gold manufacturing designator. Only
= -40°C to +125°C
= Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead
= Plastic SOIC (150mil Body), 8-lead
available on the TDFN package.
(MCP6V02 only)
(MCP6V01, MCP6V03)
Package
Single Op Amp
(Tape and Reel for 2x3 TDFN andSOIC)
Dual Op Amp
(Tape and Reel for 4×4 DFN and SOIC)
Single Op Amp with Chip Select
(Tape and Reel for SOIC)
/XXX
Examples:
a)
b)
a)
b)
a)
b)
MCP6V01T-E/SN: Extended temperature,
MCP6V01-E/MNY:Extended temperature,
MCP6V02-E/MD: Extended temperature,
MCP6V02T-E/SN: Tape and Reel,
MCP6V03-E/SN: Extended temperature,
MCP6V03-E/MNY:Extended temperature,
MCP6V01/2/3
.
8LD SOIC package.
8LD 2x3 TDFN package.
8LD 4x4 DFN package.
Extended temperature,
8LD SOIC package.
8LD SOIC package.
8LD 2x3 TDFN package.
DS22058C-page 43