XCF128XFTG64C Xilinx Inc, XCF128XFTG64C Datasheet - Page 52
XCF128XFTG64C
Manufacturer Part Number
XCF128XFTG64C
Description
IC PROM SRL 128M GATE 64-FTBGA
Manufacturer
Xilinx Inc
Datasheet
1.XCF128XFTG64C.pdf
(88 pages)
Specifications of XCF128XFTG64C
Memory Size
128Mb
Programmable Type
In System Programmable
Voltage - Supply
1.7 V ~ 2 V
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TBGA
Access Time
85ns
Supply Voltage Range
1.7V To 2V
Memory Case Style
FTBGA
No. Of Pins
64
Operating Temperature Range
-40°C To +85°C
Svhc
No SVHC (15-Dec-2010)
Package /
RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1578
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XCF128XFTG64C
Manufacturer:
XILINX
Quantity:
319
Part Number:
XCF128XFTG64C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
X-Ref Target - Figure 30
Notes:
1.
2.
3.
4.
5.
DS617 (v3.0.1) January 07, 2010
Product Specification
READY_WAIT
The number of clock cycles to be inserted depends on the X latency set in the Configuration Register.
The READY_ WAIT signal is configured to be active during wait state. READY_ WAIT signal is active Low.
The CLOCK signal can be held High or Low.
Address latched and data output on the rising clock edge. Either the rising or the falling edge of the clock signal, K, can be configured as the
active edge. Here, the active edge is the rising one.
From the moment data is valid, soon after G becomes asserted, the READY_WAIT signal reverts its previous level.
DQ15–DQ0
A22–A0
R
K
(2,5)
W
(4)
G
E
L
Hi-Z
Hi-Z
High
T
ELKH
Figure 30: Synchronous Burst Read Suspend AC Waveforms, CR4 = 0
VALID ADDRESS
T
AVLH
T
AVKH
T
LLKH
T
KHAX
T
ELTV
T
LLLH
T
GLQX
T
GLTV
Note 1
T
GLQV
Platform Flash XL High-Density Configuration and Storage Device
www.xilinx.com
VALID
T
KHQV
VALID
T
GHTZ
T
Note 3
GHQZ
VALID
T
T
T
EHEL
EHQX
EHQZ
T
GHQX
VALID
DS617_24_053008
T
EHTZ
52