MT46H16M16LFBF-6 IT:A Micron Technology Inc, MT46H16M16LFBF-6 IT:A Datasheet - Page 79

• Manufacturer Part Number: MT46H16M16LFBF-6 IT:A
• Description: IC DDR SDRAM 256MBIT 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M16LFBF-6 IT:A

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-VFBGA
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant
• Other names: Q3368612

Figure 51:
PDF: 09005aef82091978 / Source: 09005aef8209195b
MT46H16M16LF__2.fm - Rev. H 6/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
herein. Although considered final, these specifications are subject to change, as further product development and data
Seating
plane
90X 0.45
0.1 A
11.2
0.8 TYP
5.6
90-Ball VFBGA Package
A
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Note:
9
8
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.2
7
All dimensions are in millimeters.
8 ±0.1
6.4
Ball A1 ID
4 ±0.05
3
2
characterization sometimes occur.
1
their respective owners.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
0.8 TYP
79
13 ±0.1
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x16, x32 Mobile DDR SDRAM
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Package Dimensions
©2005 Micron Technology, Inc. All rights reserved.
Ball A1 ID