MT46H16M16LFBF-6 IT:A Micron Technology Inc, MT46H16M16LFBF-6 IT:A Datasheet - Page 31

• Manufacturer Part Number: MT46H16M16LFBF-6 IT:A
• Description: IC DDR SDRAM 256MBIT 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H16M16LFBF-6 IT:A

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 60-VFBGA
• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant
• Other names: Q3368612

Figure 16:
PDF: 09005aef82091978 / Source: 09005aef8209195b
MT46H16M16LF__2.fm - Rev. H 6/08 EN
Command
Command
Address
Address
DQS
DQS
CK#
CK#
DQ
DQ
CK
CK
Nonconsecutive READ Bursts
Notes:
READ
Bank,
READ
Bank,
Col n
Col n
T0
T0
1. D
2. BL = 4 or 8 (if burst is 8, the second burst interrupts the first).
3. Shown with nominal
4. Example applies when READ commands are issued to different devices or nonconsecutive
READs.
CL = 2
OUT
NOP
NOP
n (or b) = data-out from column n (or column b).
T1
T1
CL = 3
T1n
T1n
D
OUT
n
NOP
NOP
T2
T2
t
AC,
D
t
n+1
T2n
T2n
DQSCK, and
OUT
31
D
D
READ
READ
Bank,
Bank,
Col b
Col b
n+2
T3
OUT
T3
n
OUT
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
256Mb: x16, x32 Mobile DDR SDRAM
DQSQ.
T3n
T3n
D
D
n+1
n+3
OUT
OUT
CL = 2
Transitioning data
D
T4
T4
n+2
NOP
NOP
OUT
CL = 3
T4n
T4n
D
n+3
OUT
T5
T5
NOP
NOP
©2005 Micron Technology, Inc. All rights reserved.
D
OUT
b
T5n
T5n
Don’t Care
D
b+1
OUT
Operations
T6
T6
NOP
NOP
D
D
b+2
OUT
OUT
b