CY7C1471BV33_11 CYPRESS [Cypress Semiconductor], CY7C1471BV33_11 Datasheet - Page 24

• Manufacturer Part Number: CY7C1471BV33_11
• Description: 72-Mbit (2 M x 36/4 M x 18/1 M x 72) Flow-Through SRAM with NoBL Architecture
• Manufacturer: CYPRESS [Cypress Semiconductor]

Electrical Characteristics
Over the Operating Range
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Document Number: 001-15029 Rev. *E
I
C
C
C
C
C
Parameter
Parameter
SB4
Parameter
ADDRESS
DATA
CTRL
CLK
I/O
OUTPUT
OUTPUT
θ
θ
JA
JC
3.3 V I/O Test Load
2.5 V I/O Test Load
Address input capacitance
Data input capacitance
Control input capacitance
Clock input capacitance
I/O capacitance
Automatic CE
power-down
current—TTL inputs
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
= 50 Ω
= 50 Ω
Description
Description
Description
[15, 16]
(a)
(a)
V
V
L
L
= 1.25 V
= 1.5 V
(continued)
R
R
L
L
= 50 Ω
= 50 Ω
OUTPUT
OUTPUT
V
V
f = 0, inputs static
3.3 V
2.5 V
Figure 4. AC Test Loads and Waveforms
DD
IN
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
according to EIA/JESD51.
≥ V
INCLUDING
INCLUDING
= Max, device deselected,
T
CY7C1471BV33, CY7C1473BV33, CY7C1475BV33
A
DD
Test Conditions
JIG AND
JIG AND
= 25 °C, f = 1 MHz,
SCOPE
SCOPE
V
V
Test Conditions
5 pF
5 pF
– 0.3 V or V
DDQ
DD
= 3.3 V
= 2.5 V
(b)
(b)
R = 317 Ω
R = 1667 Ω
Test Conditions
IN
R = 351 Ω
R = 1538 Ω
≤ 0.3 V,
100-pin TQFP
All Speeds
Package
V
TQFP Max
GND
GND
V
DDQ
100-pin
DDQ
6
5
8
6
5
24.63
2.28
≤ 1 ns
≤ 1 ns
10%
10%
165-ball FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
FBGA Max
165-ball
6
5
8
6
5
16.3
90%
90%
2.1
Min
(c)
(c)
–
209-ball BGA
FBGA Max
Package
209-ball
15.2
1.7
6
5
8
6
5
90%
90%
Max
165
Page 24 of 35
10%
10%
≤ 1 ns
≤ 1 ns
Unit
°C/W
°C/W
Unit
Unit
mA
pF
pF
pF
pF
pF
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