m52s128168a-7tig Elite Semiconductor Memory Technology Inc., m52s128168a-7tig Datasheet - Page 23

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m52s128168a-7tig

Manufacturer Part Number
m52s128168a-7tig
Description
2m X 16 Bit X 4 Banks Synchronous Dram
Manufacturer
Elite Semiconductor Memory Technology Inc.
Datasheet
ESMT
Write with Auto Precharge
same bank should not be issued until the internal precharge is completed. The internal precharge begins after keeping t
Auto Refresh & Self Refresh
Auto Refresh
the clock(CLK). All banks must be precharged and idle for t
external address pins is requires once this cycle has started because of the internal address counter. When the refresh cycle has
completed, all banks will be in the idle state. A delay between the auto refresh command and the next activate command or
subsequent auto refresh command must be greater than or equal to the t
and the maximum absolute interval between any AUTO REFRESH command and the next AUTO REFRESH command is 8x15.6
μm.
Elite Semiconductor Memory Technology Inc.
C O M M A N D
C K E = H i g h
If A10 is high when write command is issued, the write with auto-precharge function is performed. Any new command to the
An auto refresh command is issued by having CS , RAS and CAS held low with CKE and WE high at the rising edge of
A maximum of eight consecutive AUTO REFRSH commands (with tRFCmin) can be posted to any given Mobile DDR SDRAM,
C O M M A N D
C L K
C L K
<Burst Length = 4>
D Q ' s
C L K
D Q S
C L K
A C T I V E
B a n k A
P R E
0
N O P
t
R P
1
A uto Pr echar ge
W rite A
Preliminary
2
Refr esh
Auto
N O P
D
IN
0
RP
3
D
(min) before the auto refresh command is applied. No control of the
I N
1
N O P
D
I N
2
t
R F C
4
RFC
D
IN
(min).
3
N O P
5
I n t e r n a l p r e c h a r g e s t a r t
t
N O P
Revision : 1.4
W R
Publication Date : Sep. 2008
6
* B a n k c a n b e r e a c t i v a t e d a t
c o m p l e t i o n o f
N O P
M53D128168A
C M D
7
t
R P
t
R P
N O P
WR
8
23/47
(min).

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