mpc8641 Freescale Semiconductor, Inc, mpc8641 Datasheet - Page 88

• Manufacturer Part Number: mpc8641
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Package
16 Package
This section details package parameters and dimensions.
16.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and
lead-free (FC-CBGA).
For all package types:
For high-lead FC-CBGA (package option: HCTE
For RoHS lead-free FC-CBGA (package option: HCTE
88
Die size
Package outline
Interconnects
Pitch
Total Capacitor count
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
Maximum module height
Minimum module height
Solder Balls
Ball diameter (typical
1
2
High-coefficient of thermal expansion
Typical ball diameter is before reflow
Package Parameters for the MPC8641
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
2
2
)
)
1 mm
43 caps; 100 nF each
2.47 mm
89.5% Pb 10.5% Sn
0.60 mm
2.27 mm
95.5% Sn 4.0% Ag 0.5% Cu
0.60 mm
12.1 mm × 14.7 mm
33 mm × 33 mm
1023
2.97 mm
2.77 mm
1
HX)
1
VU)
Freescale Semiconductor