upd78f0114m6gb-8es Renesas Electronics Corporation., upd78f0114m6gb-8es Datasheet - Page 485

• Manufacturer Part Number: upd78f0114m6gb-8es
• Description: 8-bit Single-chip Microcontrollers
• Manufacturer: Renesas Electronics Corporation.

µ
µ
µ
µ
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
VPS
Wave soldering
Partial heating
PD78F0114M1GB-8ES, 78F0114M2GB-8ES, 78F0114M3GB-8ES, 78F0114M4GB-8ES, 78F0114M5GB-8ES,
PD
PD
PD
Soldering Method
78F0114M6GB-8ES, 78F0114M1GB(A)-8ES, 78F0114M2GB(A)-8ES, 78F0114M3GB(A)-8ES,
78F0114M4GB(A)-8ES, 78F0114M5GB(A)-8ES, 78F0114M6GB(A)-8ES, 78F0114M1GB(A1)-8ES,
78F0114M2GB(A1)-8ES, 78F0114M5GB(A1)-8ES, 78F0114M6GB(A1)-8ES
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature), Exposure
limit: 3 days
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Table 30-1. Surface Mounting Type Soldering Conditions (2/2)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for 10 hours)
User’s Manual U16227EJ3V0UD
Soldering Conditions
Note
Note
(after that, prebake at 125°C for 10
(after that, prebake at 125°C for 10
IR35-103-2
VP15-103-2
WS60-103-1
Condition Symbol
Recommended
−
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